| 摘要 |
Size reduction and high integration of each of the laminated substrates are achieved, while forming an excellent wiring which electrically connects the substrates to each other. A conductive ink, i.e., an ink (I), containing a conductive material is used, and in a state where a voltage is applied between a print head (2) and a substrate unit (10), an ink droplet (R) of the conductive ink is discharged from the print head (2), while relatively shifting the substrate unit (10) and the print head (2) substantially parallel to at least the upper surface of the substrate (11). Thus, a conductive layer (12) which electrically connects electrodes (112) to each other between the substrates (11) is formed. |
