| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink of a semiconductor device, which recovers a thermal conductive grease which leaks to the peripheries of the semiconductor element and drops downwardly from an element-attaching portion, caused by fluidization of the thermal conductive grease or separation of an oil ingredient associated with high temperature heating to prevent the peripheries of the equipment from being stained without impairing the thermal conductivity between the semiconductor element and the element-attaching portion of the heat sink. SOLUTION: In a heat sink of a semiconductor device including a heat radiation fin 11 formed on an external wall surface of the heat sink and a power semiconductor element 20 such as IGBT attached vertically in an erected state to an element-attaching portion 12 on the internal wall surface, a grease reservoir 17 is formed on the internal wall surface of the heat sink 11, below the element-attaching portion 12, and a grease gutter 18 is formed for receiving the leaked grease dropping down from the element-attaching surface and introducing the grease to the grease reservoir 17; the grease gutter 18 and the grease reservoir 17 are formed integrally to the heat sink 10 by aluminum die casting. COPYRIGHT: (C)2011,JPO&INPIT |
