发明名称 熱伝導性樹脂組成物およびそれからなる成形体
摘要 PROBLEM TO BE SOLVED: To provide a heat conductive resin composition having excellent heat conductivity, impact resistance and heat resistance, and a molded product formed thereof. SOLUTION: The heat conductive resin composition contains a polyamide resin A, a graphite-based filler B, and an aramid fiber C. A mass ratio A/B of the polyamide resin A to the graphite filler B is 15/85 to 60/40. Based on 100 pts.mass of the total of the polyamide resin A and the graphite-based filler B, a content of the aramid fiber C is 3-20 pts.mass. In the heat conductive resin composition, a coefficient of heat conductivity is≥10 W/m×K, Izod impact strength with notch is≥60 J/m, and a deflection temperature under a load of 1.8 MPa is≥100°C. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP5618039(B2) 申请公布日期 2014.11.05
申请号 JP20080145755 申请日期 2008.06.03
申请人 发明人
分类号 C08L77/00;C08K3/04;C08K7/02 主分类号 C08L77/00
代理机构 代理人
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