发明名称 チップピックアップ方法およびチップ実装方法ならびにチップ実装装置
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a chip pickup method, a chip mounting method and a chip mounting apparatus capable of increasing the work efficiency. <P>SOLUTION: In a pickup chip determination step, a target chip, which should be picked up next after one chip is picked up from one area, is determined based on a piece of characteristic information. A qualified chip, which has been determined qualified as a chip to be picked up, is searched referring to a piece of map data, and the qualified chip which is included in the identical area is determined first as a chip to be picked up next. When no qualified chip is found in the area, a qualified chip included in an area closest to the area is determined as the chip to be picked up next. This reduces a wasteful operation time for performing the relative movement from one edge to the other edge of a wafer in the pickup operation by a pickup head which performs a relative movement; and as a result, the work efficiency is increased. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5617787(B2) 申请公布日期 2014.11.05
申请号 JP20110161677 申请日期 2011.07.25
申请人 发明人
分类号 H05K13/04;H01L21/52;H01L21/60;H01L21/67 主分类号 H05K13/04
代理机构 代理人
主权项
地址