| 摘要 |
PROBLEM TO BE SOLVED: To carry out a press step for laminating an outer layer substrate on a base wiring board on which plated through holes, and the like, are provided by a hot-and-hot system, and to reduce variation in the thickness of a multilayer printed wiring board thus formed. SOLUTION: A base wiring board 6 provided, on the surface thereof, with a plated through hole 4 is prepared. The base wiring board 6 is sandwiched, from both sides, by an adhesive film 7 consisting of a liquidity polymer precursor not containing a solvent, an outer layer substrate 8, a release film 9 and an elastic plate 10, in this order, to form a mat configuration 11. The plated through hole 4 is filled with the liquidity polymer precursor of the molten adhesive film 7 by hot pressing the mat configuration 11 with an elastic hot plate 12. A multilayer printed wiring board in which the outer layer substrate 8 is laminated on the base wiring board 6 is formed, and the liquidity polymer precursor of the multilayer printed wiring board is hardened by thermosetting treatment. COPYRIGHT: (C)2012,JPO&INPIT |
