发明名称 |
SUBSTRATE FOR POWER MODULE WITH HEAT SINK AND METHOD FOR PRODUCING THE SAME, POWER MODULE WITH HEAT SINK, AND SUBSTRATE FOR POWER MODULE |
摘要 |
<p>A power module substrate having a heatsink, includes: a power module substrate (11) having an insulating substrate (12) having a first face (12a) and a second face (12b), a circuit layer (13) formed on the first face (12a), and a metal layer (14) formed on the second face (12b); and a heatsink (17) directly connected to the metal layer (14), cooling the power module substrate (11), wherein a ratio B/A is in the range defined by 1.5 ‰¦ B/A ‰¦ 20, where a thickness of the circuit layer (13) is represented as A, and a thickness of the metal layer (14) is represented as B.</p> |
申请公布号 |
EP2259308(A4) |
申请公布日期 |
2014.11.05 |
申请号 |
EP20090721361 |
申请日期 |
2009.03.11 |
申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
HAYASHI, HIROMASA;KITAHARA, TAKESHI;TONOMURA, HIROSHI;ISHIZUKA, HIROYA;KUROMITSU, YOSHIROU |
分类号 |
H01L23/12;H01L23/373 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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