发明名称 PEEL PLY, METHOD OF SURFACE PREPARATION AND BONDING COMPOSITE STRUCTURES USING THE SAME
摘要 A resin-rich peel ply (11) that does not leave behind residual fibers after peeling and can work well with different resin-based composite substrates (10) The resin-rich peel ply (11) is composed of a woven fabric (lib) impregnated with a resin matrix (11a) different from the resin matrix of the composite substrate (10). The peel ply (11) is designed such that, upon manual removal of the peel ply (11) from the composite substrate's (10) surface, a thin film of the peel ply resin remains on the composite substrate's surface to create a bondable surface capable of bonding with another composite substrate (12), but no fibrous material from the woven fabric remains on the same surface.
申请公布号 EP2797733(A1) 申请公布日期 2014.11.05
申请号 EP20120795687 申请日期 2012.11.16
申请人 CYTEC TECHNOLOGY CORP. 发明人 ZHAO, YIQIANG;KOHLI, DALIP, KUMAR;SHAH, KUNAL, GAURANG
分类号 B29C65/48;B29C37/00;B29C65/00;B29C65/50;B29C65/76;B29C65/82;B29C70/54;B29L31/30;C08J5/24 主分类号 B29C65/48
代理机构 代理人
主权项
地址