发明名称 A PRINTED CIRCUIT BOARD COMPRISING EMBEDED ELECTRONIC COMPONENT WITHIN AND A METHOD FOR MANUFACTURING
摘要 The present invention relates to a printed circuit board embedded with an electronic component and to a method for manufacturing the same. The printed circuit board embedded with an electronic component of the present invention includes a core consisting of a through hole and having the side wall consisting of a slope vertically symmetric based on the center part; an electronic component embedded in the cavity; an insulation layer laminated on the upper and lower part of the core including the electronic component; and an external circuit layer formed on the insulation layer.
申请公布号 KR20140128058(A) 申请公布日期 2014.11.05
申请号 KR20130046733 申请日期 2013.04.26
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, SEUNG EUN;CHUNG, YUL KYO;SHIN, YEE NA;LEE, DOO HWAN
分类号 H05K3/46;H05K1/18 主分类号 H05K3/46
代理机构 代理人
主权项
地址
您可能感兴趣的专利