Method of manufacturing a semiconductor device

摘要

A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing the block sealing member and the matrix substrate for each of the device areas by dicing, thereafter rubbing a surface of each of the diced sealing member portions with a brush, then storing semiconductor devices formed by the dicing once into pockets respectively of a tray, and conveying the semiconductor devices each individually from the tray. Since the substrate dividing work after block molding is performed by dicing while vacuum-chucking the surface of the block sealing member, the substrate division can be done without imposing any stress on an external terminal mounting surface of the matrix substrate.

主权项

1. A method of manufacturing a semiconductor device, comprising:
(a) providing an assembled product including a base material having a plurality of device areas and a dicing area arranged between the device areas, a plurality of semiconductor chips mounted on the device areas, respectively, and a block sealing member sealing the semiconductor chips; (b) after the step (a), disposing the assembled product over a dicer cutting stage via a substrate holding jig, the substrate holding jig having a product support portion, the product support portion having a groove and a plurality of through-holes; and (c) after the step (b), cutting the base material with a blade along the dicing area of the base material while chucking an upper surface of the block sealing member using the through-holes of the product support portion, wherein in the step (b), the assembled product is disposed over the substrate holding jig such that the upper surface of the block sealing member faces and contacts the product support portion, wherein in the step (b), the assembled product is disposed over the substrate holding jig such that the groove and the through-holes correspond to the dicing area and the device areas, respectively, and wherein the product support portion is comprised of rubber.