| 发明名称 | Method and apparatus for manufacturing electronic integrated circuit chip | ||
| 摘要 | A method (and apparatus) of assembling a die on an electronic substrate, includes processing an assembly including a substrate and a die, and during the processing, introducing a pre-stress to the assembly during a cure process. | ||
| 申请公布号 | US8877552(B2) | 申请公布日期 | 2014.11.04 |
| 申请号 | US201113076192 | 申请日期 | 2011.03.30 |
| 申请人 | International Business Machines Corporation | 发明人 | Sri-Jayantha Sri M. |
| 分类号 | H01L21/66;H01L21/00;H01L21/44;H01L23/34;H01L23/48 | 主分类号 | H01L21/66 |
| 代理机构 | McGinn IP Law Group, PLLC | 代理人 | Morris, Esq. Daniel P.;McGinn IP Law Group, PLLC |
| 主权项 | 1. An apparatus for assembling a die on an electronic substrate, said apparatus comprising: means for processing an assembly comprising an electronic substrate and a die; and means for introducing, during said processing, a pre-stress to said assembly during a cure process. | ||
| 地址 | Armonk NY US | ||