发明名称 |
Solar cell module and manufacturing method of solar cell module |
摘要 |
A solar cell module includes a structure in which a back surface material, a back-surface-side sealing resin, a solar cell, a light-receiving-surface-side sealing resin, and a front surface material are laminated in sequential order, in which a melting point of a portion, which is in contact with the solar cell, of at least one of the light-receiving-surface-side sealing resin and the back-surface-side sealing resin is lower than a melting point of a portion, which is in contact with the back surface material, of the back-surface-side sealing resin. |
申请公布号 |
US8877540(B2) |
申请公布日期 |
2014.11.04 |
申请号 |
US201013808319 |
申请日期 |
2010.08.05 |
申请人 |
Mitsubishi Electric Corporation |
发明人 |
Utsunomiya Keiichiro |
分类号 |
H01L21/00;H01L31/18;H01L31/048;B32B17/10 |
主分类号 |
H01L21/00 |
代理机构 |
Buchanan Ingersoll & Rooney PC |
代理人 |
Buchanan Ingersoll & Rooney PC |
主权项 |
1. A manufacturing method of a solar cell module, wherein
in lamination process, in which a structure in which a back surface material, a back-surface-side sealing resin, a solar cell, a light-receiving-surface-side sealing resin, and a front surface material are laminated in sequential order is integrated by applying pressure while heating the structure, temperature of the light-receiving-surface-side sealing resin and the back-surface-side sealing resin is controlled to be higher than a melting point of a portion, which is in contact with the solar cell, of at least one of the light-receiving-surface-side sealing resin and the back-surface-side sealing resin and lower than a melting point of a portion, which is in contact with the back surface material, of the back-surface-side sealing resin, the temperature of the manufacturing method being controlled to not be equal to or higher than the melting point of the portion of the back-surface-side-sealing resin in contact with the back surface material so that deformation of the back surface material is suppressed. |
地址 |
Chiyoda-Ku, Tokyo JP |