发明名称 |
Process for producing liquid ejection head |
摘要 |
A process for producing a liquid ejection head by providing, in one chip, a liquid ejection head having a portion for ejection in which an ejection orifice array is arranged and a side portion having no ejection orifice array, these portions being provided with a member of a photosensitive material, arranging the chip on a common substrate in such a chip array that these two portions are alternately arranged, and separating each chip from the substrate, the process including the steps of relatively moving a reticle of an aligner along the chip array for a photosensitive material on the substrate to expose each chip, and developing the material to obtain the member. A first reticle for forming the portion for ejection and a second reticle for forming only the side portion are used. The exposure includes a first and a second exposure treatment respectively by the first and second reticles. |
申请公布号 |
US8877431(B2) |
申请公布日期 |
2014.11.04 |
申请号 |
US201414146197 |
申请日期 |
2014.01.02 |
申请人 |
Canon Kabushiki Kaisha |
发明人 |
Kodoi Takuma;Muraoka Chiaki;Tomizawa Keiji |
分类号 |
G03F7/20;B41J2/16 |
主分类号 |
G03F7/20 |
代理机构 |
Fitzpatrick, Cella, Harper & Scinto |
代理人 |
Fitzpatrick, Cella, Harper & Scinto |
主权项 |
1. A process for producing a liquid ejection head by providing, in one chip, a liquid ejection head having a portion for ejection in which an ejection orifice array is arranged and a side portion having no ejection orifice array, these portions being provided with a member formed from a photosensitive material, arranging the chip on a common substrate as a chip array in which the chip is arranged in such a manner that the portion for ejection and the side portion are alternately arranged, and separating each chip from the common substrate to obtain the liquid ejection head, the process comprising:
an exposure step of relatively moving a reticle of an aligner along the chip array with respect to a photosensitive material provided on the common substrate to expose each chip, and a development step of developing the photosensitive material subjected to the exposure treatment to obtain the member formed from the photosensitive material, wherein a first reticle for forming at least the portion for ejection and a second reticle for forming only the side portion are used as the reticle, and wherein the exposure step comprises a first exposure treatment by the first reticle for at least the portion for ejection and a second exposure treatment by the second reticle for the side portion. |
地址 |
Tokyo JP |