| 发明名称 | Microneedle and method of manufacturing microneedle | ||
| 摘要 | A method of manufacturing a microneedle including forming a plurality of first linear grooves on a substrate in parallel to one another along a first direction using grinding and forming a plurality of second linear grooves on the substrate in parallel to one another in a second direction intersecting the first direction using grinding. At least one of the forming of a plurality of first linear grooves and the forming of a plurality of second linear grooves includes forming first stage grooves using a first dicing blade; and processing the first stage grooves by tracing the first stage grooves using a second dicing blade having a side surface different from that of the first dicing blade to thereby form second stage grooves. | ||
| 申请公布号 | US8876575(B2) | 申请公布日期 | 2014.11.04 |
| 申请号 | US201213649687 | 申请日期 | 2012.10.11 |
| 申请人 | Toppan Printing Co., Ltd.;Hisamitsu Pharmaceutical Co., Inc. | 发明人 | Sugimura Hiroshi;Suzuki Gaku;Ueno Masahiro;Kodama Yoshihiro;Tomono Takao |
| 分类号 | B24B1/00;B24B19/16;B29C33/42;B29C33/38;A61M37/00;B29L31/00 | 主分类号 | B24B1/00 |
| 代理机构 | Staas & Halsey LLP | 代理人 | Staas & Halsey LLP |
| 主权项 | 1. A method of manufacturing a microneedle, comprising: forming a plurality of first linear grooves on a substrate in parallel to one another along a first direction using grinding; and forming a plurality of second linear grooves on the substrate in parallel to one another in a second direction intersecting the first direction using grinding, wherein at least one of the forming of a plurality of first linear grooves and the forming of a plurality of second linear grooves includes: forming first stage grooves using a first dicing blade; and processing the first stage grooves by tracing the first stage grooves using a second dicing blade having a side surface different from that of the first dicing blade to thereby form second stage grooves. | ||
| 地址 | Tokyo JP | ||