发明名称 Link power management in an I/O interconnect
摘要 Described are embodiments of methods, apparatuses, and systems for link power management in an I/O interconnect. An apparatus for link power management in an I/O interconnect of a computer apparatus may include a switching fabric having a first switch and a second switch, configured to simultaneously transport first data packets over a first path of a link between a port of the first switch and a port of the second switch and second data packets over a second path of the link. The apparatus may include a power management unit configured to modify a power state of the port of the first switch based at least in part on relative power states of the first path and the second path. Other embodiments may be described and claimed.
申请公布号 US8880923(B2) 申请公布日期 2014.11.04
申请号 US201213434782 申请日期 2012.03.29
申请人 Intel Corporation 发明人 Saunders Bradley;Ravichandran Krishnan
分类号 G06F1/00 主分类号 G06F1/00
代理机构 Schwabe Williamson & Wyatt PC 代理人 Schwabe Williamson & Wyatt PC
主权项 1. An apparatus comprising: an I/O interconnect including a switching fabric having a first switch and a second switch, configured to simultaneously transport first data packets over a first path of a link between a port of the first switch and a port of the second switch and second data packets over a second path of the link; and a power management unit in the first switch, configured to modify a power state of the port of the first switch based at least in part on relative power states of the first path and the second path of the link.
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