Heat transfer system

摘要

The memory module comprises a circuit board with a first and a second side, wherein memory chips are arranged at least on the first side. A longitudinally extending module heat conductor is arranged on the first side. The module heat conductor comprises a contact surface configured to contact a heat transfer system.

主权项

1. A memory module, comprising:
a circuit board with a first and a second side comprising:
memory chips, which are arranged on the first side and the second side;a first module heat pipe having at least a portion that extends longitudinally on the first side, the first module heat pipe forming a first contact surface;a second module heat pipe having at least a portion that extends longitudinally on the second side, the second module heat pipe forming a second contact surface; anda heat transfer system comprising:
a coupling element comprising a first coupling member configured to contact to the first contact surface and a second coupling member configured to contact the second contact surface, anda central heat conductor, wherein the first and second coupling members are configured to thermally couple the memory chips to the central heat conductor via the first and second module heat pipes.