| 发明名称 | Integrated device with defined heat flow | ||
| 摘要 | An integrated device includes at least one heat generating component which generates heat when operated, at least one temperature-sensitive component, and one or more hollow insulation regions arranged between the at least one heat generating component and the at least one temperature-sensitive component. The hollow insulation region may be provided as a vacuum gap. | ||
| 申请公布号 | US8878071(B2) | 申请公布日期 | 2014.11.04 |
| 申请号 | US201213352151 | 申请日期 | 2012.01.17 |
| 申请人 | International Business Machines Corporation | 发明人 | Brunschwiler Thomas;Hofrichter Jens |
| 分类号 | H05K1/00;H05K1/02 | 主分类号 | H05K1/00 |
| 代理机构 | Otterstadt, Ellenbogen & Kammer, LLP | 代理人 | Davis Jennifer R.;Otterstadt, Ellenbogen & Kammer, LLP |
| 主权项 | 1. Integrated device comprising: at least one heat generating component which generates heat when operated; at least one temperature-sensitive component; and at least one hollow insulation region arranged between the at least one heat generating component and the at least one temperature-sensitive component, wherein the at least one hollow insulation region is provided as a vacuum gap including a vacuum or a low-pressured gas, and wherein on opposing sides of the at least one hollow insulation region a waveguide and an optical element are arranged such that laser light emitted from or received by the optical element is coupled through the at least one hollow insulation region, in particular by evanescent coupling. | ||
| 地址 | Armonk NY US | ||