Structural body and method for manufacturing semiconductor substrate

摘要

A structural body includes a sapphire underlying substrate; and a semiconductor layer of a group III nitride semiconductor disposed on the underlying substrate. An upper surface of the underlying substrate is a crystal surface tilted at an angle of 0.5° or larger and 4° or smaller with respect to a normal line of an a-plane which is orthogonal to an m-plane and belongs to a {11-20} plane group, from the m-plane which belongs to a {1-100} plane group.

主权项

1. A method for manufacturing a semiconductor substrate, comprising:
a first step of, during a first period, treating an upper surface of a sapphire underlying substrate by supplying a group III raw material onto the upper surface of the underlying substrate without supplying a group V raw material in a state where the sapphire underlying substrate is heated at a first temperature; and a second step of, during a second period which follows the first period, growing a semiconductor layer of the group III nitride semiconductor on the underlying substrate by supplying the group V raw material in addition to the group III raw material on the upper surface of the underlying substrate in the state where the underlying substrate is heated at the first temperature, wherein the upper surface of the underlying substrate is a crystal surface tilted at an angle of 0.5° or larger and 4° or smaller with respect to a normal line of an a-plane which is orthogonal to an m-plane and belongs to a {11-20} plane group, from the m-plane which belongs to a {1-100} plane group.