| 发明名称 | Stacked heat dissipating module of an electronic device | ||
| 摘要 | A stacked heat dissipating module of an electronic device has a holding frame, and at least one first heat conducting medium layer, a heat dissipating medium layer, a first heat sink layer, at least one second heat conducting medium layer and at least one second heat sink layer stacked with each other. The at least one first heat conducting medium layer is mounted on at least one heating component of the electronic device to dissipate heat generated from the at least one heating component. Moreover, the holding frame, the heat conducting medium layers and the heat sink layers have corresponding housing holes for exposing an exposed component of the electronic device to bring the exposed component's function into full play. | ||
| 申请公布号 | US8879264(B2) | 申请公布日期 | 2014.11.04 |
| 申请号 | US201213644776 | 申请日期 | 2012.10.04 |
| 申请人 | Gemtek Technology Co., Ltd. | 发明人 | Tsai Yu-Jen |
| 分类号 | H05K7/20;G06F1/20 | 主分类号 | H05K7/20 |
| 代理机构 | Hershkovitz & Associates, PLLC | 代理人 | Hershkovitz & Associates, PLLC ;Hershkovitz Abraham |
| 主权项 | 1. A stacked heat dissipating module of an electronic device comprising: at least one first heat conducting medium layer adapted for being mounted on at least one heating component of the electronic device; and a first heat sink layer mounted on and attached to the at least one first heat conducting medium layer and having a housing hole formed through the first heat sink layer for exposing an exposed component of the electronic device. | ||
| 地址 | TW | ||