Methods and apparatus for compact active cooling

摘要

Methods and apparatus for compact active cooling for missile applications generally comprise a circuit card assembly level closed loop fluid filled cooling system for cooling high power components such as microprocessors. The present invention utilizes a cooling system constrained to a single circuit card assembly providing for a drop in replacement for current passively cooled circuit card assemblies.

主权项

1. A cooling system for a heat source on a circuit card assembly, the cooling system comprising:
a first heat exchanger configured to absorb heat from the heat source; a circulation system disposed in or on the circuit card assembly, wherein the circulation system is configured to absorb heat from the first heat exchanger using a cooling fluid; and a second heat exchanger configured to absorb heat from the cooling fluid in the circulation system and to conductively transfer heat to a body or housing surrounding the circuit card assembly; wherein the second heat exchanger comprises a spacer attached to a periphery of the circuit card assembly; wherein the circulation system comprises a pump and a flow passage configured to transport the cooling fluid between the first heat exchanger and the spacer; and wherein the flow passage comprises a channel within a portion of the spacer.