发明名称 High frequency probing structure
摘要 The present disclosure provide a probe card for wafer level testing. The probe card includes a space transformer having a power line, a ground line, and signal lines embedded therein, wherein the space transformer includes various conductive lines having a first pitch on a first surface and a second pitch on a second surface, the second pitch being substantially less than the first pitch; a printed circuit board configured approximate the first surface of the space transformer; and a power plane disposed on the first surface of the space transformer and patterned to couple the power line and the ground line of the space transformer to the printed circuit board.
申请公布号 US8878560(B2) 申请公布日期 2014.11.04
申请号 US201012982541 申请日期 2010.12.30
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Kuo Ying-Hsin;Hung Wensen
分类号 G01R31/00;G01R31/28;G01R1/073;G01R1/067 主分类号 G01R31/00
代理机构 Haynes and Boone, LLP 代理人 Haynes and Boone, LLP
主权项 1. A probe card for wafer level testing, comprising: a space transformer having a power line, a ground line, and signal lines embedded therein, wherein the space transformer includes various conductive lines having a first pitch on a first surface and a second pitch on a second surface, the second pitch being substantially less than the first pitch, with one or more embedded conductive plates within the space transformer and coupling the conductive lines having the first pitch with the conductive lines having the second pitch; a printed circuit board configured approximate the first surface of the space transformer; and a plurality of conductive plates disposed on the first surface of the space transformer and patterned to couple the power line and the ground line of the space transformer to the printed circuit board, the conductive plates having a greater contact area than a structure coupling the signal lines of the space transformer to the printed circuit board.
地址 Hsin-Chu TW