Illumination device and display device

摘要

An illumination device including: a support member accommodating therein a light guiding plate, and having a board placement space in a region where being along a longitudinal direction of an end surface of the light guiding plate, and extending from the end surface side of the light guiding plate to a back surface side thereof; and a light source circuit unit including a bendable circuit board including first and second regions, the first region including light emitting chips, and the second region being formed with a densely-packed portion of a wiring pattern of the light emitting chips. The light source circuit unit is placed in the board placement space after being bent to allow the light emitting chips to face the end surface of the light guiding plate, and to allow the densely-packed portion of the wiring pattern to come on the back surface side of the light guiding plate.

主权项

1. An illumination device, comprising:
a support member accommodating therein a light guiding plate, and having a board placement space in a region where being along a longitudinal direction of an end surface of the light guiding plate, and extending from the end surface side of the light guiding plate to a back surface side thereof; and a light source circuit unit including a bendable circuit board including first and second regions with a bending line serving as a boundary therebetween, the first region including a plurality of light emitting chips in rows, and the second region being formed with a densely-packed portion of a wiring pattern of the light emitting chips, wherein the light source circuit unit is placed in the board placement space after being bent to allow the light emitting chips to face the end surface of the light guiding plate, and to allow the densely-packed portion of the wiring pattern to come on the back surface side of the light guiding plate, and wherein the light emitting chips are divided into two or more blocks for partial driving, and the wiring pattern partially extracted from each of the blocks are arranged in parallel on a surface of the bendable circuit board in the second region and are offset to run alongside each other on the surface of the bendable circuit board in the second region.