| 摘要 |
<p>According to an embodiment of the present invention, a system for separating liquid chemicals and a wafer polishing apparatus including the same comprise a first storage; a second storage located below the first storage; a liquid chemical collecting part for accommodating liquid chemicals; a gate for distributing the liquid chemicals from the first storage to the second storage or blocking the distribution of the liquid chemicals; a separator for receiving the liquid chemicals from the second storage, and discharging the supplied liquid chemicals to either a first line or a second line; and a control part for controlling the gate and the separator.</p> |
