| 发明名称 | Liquid jetting apparatus | ||
| 摘要 | A liquid jetting apparatus includes: a liquid jetting head in which nozzles for jetting the liquid are formed and which has an actuator for jetting the liquid from the nozzles; an interposer substrate which is provided to the liquid jetting head and on which a driver IC is mounted; a control substrate which controls the liquid jetting head; a wire member which connects the interposer substrate and the control substrate; and a flexible circuit board which connects the interposer substrate and the actuator, wherein the interposer substrate has a first connecting portion to which the wire member is to be connected, and a second connecting portion to which the flexible circuit board is to be connected, and the driver IC is arranged nearer to the first connecting portion than the second connecting portion of the interposer substrate. | ||
| 申请公布号 | US8876236(B2) | 申请公布日期 | 2014.11.04 |
| 申请号 | US201213431819 | 申请日期 | 2012.03.27 |
| 申请人 | Brother Kogyo Kabushiki Kaisha | 发明人 | Kondo Hirofumi;Kato Yasuhiro;Hayashi Masayoshi;Nishikawa Tatsuya;Higashikawa Reiko;Yamashita Toru;Sueyasu Masato |
| 分类号 | B41J29/38;B41J2/14;B41J2/175 | 主分类号 | B41J29/38 |
| 代理机构 | Merchant & Gould PC | 代理人 | Merchant & Gould PC |
| 主权项 | 1. A liquid jetting apparatus which jets a liquid, comprising: a liquid jetting head in which nozzles for jetting the liquid are formed and which has an actuator for jetting the liquid from the nozzles; an interposer substrate which is provided to the liquid jetting head and on which a driver IC is mounted; a control substrate which controls the liquid jetting head; a wire member which connects the interposer substrate and the control substrate; and a flexible circuit board which connects the interposer substrate and the actuator, wherein the interposer substrate has a first connecting portion to which the wire member is to be connected, and a second connecting portion to which the flexible circuit board is to be connected, the driver IC is arranged nearer to the first connecting portion than the second connecting portion of the interposer substrate, and a penetrating portion which penetrates the interposer substrate in a thickness direction of the interposer substrate or a notch is formed in the interposer substrate, so that the penetrating portion or the notch is arranged on a virtual line which is drawn by connecting any portion of the driver IC and any portion of the second connecting portion. | ||
| 地址 | Nagoya-Shi, Aichi-Ken JP | ||