| 发明名称 | Method of manufacturing piezoelectric device | ||
| 摘要 | A method of manufacturing a piezoelectric device includes the steps of bonding a first substrate to a second substrate having a toughness greater than that of the first substrate, forming a first though-hole through the first substrate from the side opposite to the side on which the second substrate is bonded, and forming a second through-hole through the second substrate at a location corresponding to the first through-hole by a formation method different from that used to form the first through-hole from the side opposite to the side on which the first substrate is bonded. | ||
| 申请公布号 | US8875362(B2) | 申请公布日期 | 2014.11.04 |
| 申请号 | US201012968303 | 申请日期 | 2010.12.15 |
| 申请人 | Murata Manufacturing Co., Ltd. | 发明人 | Miyake Takashi;Toyota Yuji |
| 分类号 | H03H3/02;H03H9/15;H03H9/02;H03H9/10 | 主分类号 | H03H3/02 |
| 代理机构 | Keating & Bennett, LLP | 代理人 | Keating & Bennett, LLP |
| 主权项 | 1. A method of manufacturing a piezoelectric device, comprising the steps of: bonding a first substrate to a surface of a second substrate having a toughness greater than that of the first substrate; forming a first though-hole through the first substrate from a side opposite to a side on which the second substrate is bonded; and forming a second through-hole through the second substrate from a side opposite to a side on which the first substrate is bonded, at a location corresponding to the first through-hole, by a formation method different from that used to form the first through-hole; wherein the first substrate is a piezoelectric substrate; and a coefficient of linear expansion of the second substrate is less than that of the first substrate. | ||
| 地址 | Kyoto JP | ||