| 摘要 |
<p>A bonding finger comprises a substrate, a molding glue layer, and multiple wires capable of being electrically connected to a circuit board. The molding glue layer is mounted on one side of the substrate, a side of the molding glue layer far away from the substrate is provided with latticed grooves, and the wires comprise conductive grids accommodated in the grooves; the molding glue layer is mounted on one side of the substrate, a side of the molding glue layer far away from the substrate is provided with latticed grooves, and conductive grids are accommodated in the grooves to form the wires, to form a bonding finger. The bonding finger is disposed on a sensing element, and the wires of the bonding finger are electrically connected to the circuit board by anisotropic conductive adhesive. The conductive grids of the wires are accommodated in the grooves, and the latticed form is used; in this way, the contact area of the wires and the molding glue layer is increased, and the wires are bonded to the molding glue layer more closely, so that the wires do not fall off easily or are not scratched, thereby ensuring the conductivity of the bonding finger, and improving the performance of the touch screen. The present invention also provides a touchscreen having the bonding finger.</p> |
