发明名称 Thermosetting silicone resin composition for reflector of LED, reflector for LED using the same and optical semiconductor apparatus
摘要 A thermosetting silicone resin composition for an LED reflector has: a thermosetting resin; at least one kind of white pigment selected from titanium oxide, zinc oxide, zirconium oxide, magnesium oxide, barium carbonate, magnesium silicate, zinc sulfate, and barium sulfate; and an inorganic filler other than the pigment, which contains at least one kind of inorganic filler that has an average particle diameter of 30 μm to 100 μm and a refraction index that is different from a refraction index of a cured material of the thermosetting resin by 0.05 or more, and at least one kind of inorganic filler that has an average particle diameter of less than 30 μm. The thermosetting resin composition provides a cured material that has excellent heat and light resisting properties and hardly leaks light, a reflector for an LED obtained by molding using the composition, and an optical semiconductor apparatus using the reflector.
申请公布号 US8877849(B2) 申请公布日期 2014.11.04
申请号 US201313853368 申请日期 2013.03.29
申请人 Shin-Etsu Chemical Co., Ltd. 发明人 Shiobara Toshio;Kashiwagi Tsutomu;Kusunoki Takayuki;Tsutsumi Yoshihiro
分类号 C08K3/22;F21S8/10;C08L83/04;H01L23/00;F21V7/22;H01L33/60;F21Y101/02;H01L33/48 主分类号 C08K3/22
代理机构 Oliff PLC 代理人 Oliff PLC
主权项 1. A thermosetting resin composition for a reflector of LED, comprising: (A) 100 parts by mass of a thermosetting resin; (B) 3 to 200 parts by mass of white pigment selected from the group consisting of titanium oxide, zinc oxide, zirconium oxide, magnesium oxide, barium carbonate, magnesium silicate, zinc sulfate, and barium sulfate; and (C) 200 to 1300 parts by mass of an inorganic filler other than the component (B), which contains at least the following component (C-1) and the following component (C-2): (C-1) 100 to 1000 parts by mass of at least one kind of inorganic filler that has an average particle diameter of 30 μm to 100 μm and a refraction index that is different from a refraction index of a cured material of the thermosetting resin of the component (A) by 0.05 or more; and(C-2) 100 to 800 parts by mass of at least one kind of inorganic filler that has an average particle diameter of less than 30 μm.
地址 Tokyo JP