| 摘要 |
<p>According to the present invention, an apparatus to combine a substrate includes: a chamber; an upper plate provided in the chamber including an upper adhesive chuck to adhere a first substrate; a lower plate provided in the chamber including a lower adhesive chuck to adhere a second substrate adhering to the first substrate; an operation pin being flexibly operated to adsorb and move the first substrate to the upper plate; a first pump connected to the chamber to form inside the chamber in a vacuum state of predetermined pressure, and provide adhesive force to the operation pin; a second pump connected to the chamber to form inside the chamber in a vacuum state lower than the vacuum state formed by the first pump; and a gas supply member connected to the chamber to supply gas to the first substrate separated from the upper plate such that the first substrate is combined with the second substrate. According to the present invention having the construction mentioned above, a substrate is stably supported by the adhesive force, and the substrate is easily attached or detached by the adhesive force. Since the substrate is combined through gas, the substrate is prevented from being damaged such that productivity is improved.</p> |
