发明名称 Storage apparatus, storage controller for storage apparatus, chassis for storage controller
摘要 A storage apparatus S comprises a disk controller for controlling data I/O processing between a host H and a disk unit. The disk controller includes a plurality of circuit board modules each having a circuit board and a module case storing the same, and a chassis shaped like a hollow cylinder having a front side opening and a rear side opening and configured to store the circuit board modules from the front and rear side openings. A CM module is configured to introduce cooling air from a cooling fan through an opening provided on at least one side surface toward a circuit component mounted on the circuit board. A MP module is configured to introduce cooling air by a cooling fan through an opening provide on a front surface of the module case.
申请公布号 US8879248(B2) 申请公布日期 2014.11.04
申请号 US201213553906 申请日期 2012.07.20
申请人 Hitachi, Ltd. 发明人 Tanaka Shigeaki;Abe Kentaro
分类号 H05K7/20;G06F1/20;G11B33/14 主分类号 H05K7/20
代理机构 Brundidge & Stanger, P.C. 代理人 Brundidge & Stanger, P.C.
主权项 1. A storage apparatus comprising: physical storage media for storing data; and a storage controller coupled to the physical storage media for controlling data input/output (I/O) processing to the physical storage media, wherein the storage controller includes: a plurality of circuit board modules each having a circuit board implementing a predetermined function of the storage controller and a circuit board case storing the circuit board; a chassis having a hollow container with a front side opening and a rear side opening, configured to store the plurality of circuit board modules from the front and rear side openings; a first fan inserted from the front side opening to the chassis, configured to send first cooling air into one or more circuit board modules from a front side to a rear side by pushing the first cooling air; and a second fan inserted from the rear side opening to the chassis, configured to send second cooling air into one or more circuit board modules from the front side to the rear side by pulling the second cooling air, wherein the plurality of circuit board modules include: a first circuit board module inserted from the front side opening, arranged adjacent to the first fan, having a first opening on a surface toward the first fan, and configured to introduce the first cooling air from the first fan through the first opening; a second circuit board module inserted from the front side opening to be opposed to the second fan, having a second opening on a surface toward the second fan and third opening on a surface toward the front side opening, and configured to introduce the second cooling air through the third opening and exhaust the second cooling air to the second fan through the second opening; and a third circuit board module inserted from the rear side opening to be opposed to the first circuit board module, having a fourth opening, and configured to introduce the first cooling air, which is flowed out from the first circuit board module, through the fourth opening.
地址 Tokyo JP