发明名称 Cartridge having molded resin electrode
摘要 A cartridge is provided with an electrode portion for connecting a main assembly contact. The cartridge electrode includes a first contact portion, exposed toward an outside of a frame of the cartridge, contacted to a main assembly contact provided in the apparatus main assembly. The cartridge electrode further includes a second contact portion provided for being electrically connected to a process means of the cartridge, and an injection receiving portion into which resin is injected when the cartridge electrode is molded into the frame. The electroconductive resin injected from the injection receiving portion is branched to mold the first contact portion and the second contact portion so that an electroconductive path for electrically connecting the main assembly contact and the process means is formed.
申请公布号 US8879944(B2) 申请公布日期 2014.11.04
申请号 US201213556653 申请日期 2012.07.24
申请人 Canon Kabushiki Kaisha 发明人 Takarada Hiroshi;Hirukawa Kuniaki;Suzuki Akira;Hoshi Nobuharu;Fukui Yuichi
分类号 G03G15/00;G03G21/18 主分类号 G03G15/00
代理机构 Fitzpatrick, Cella, Harper & Scinto 代理人 Fitzpatrick, Cella, Harper & Scinto
主权项 1. A cartridge detachably mountable to an apparatus main assembly of an image forming apparatus, said cartridge comprising: (i) process means for effecting image formation; (ii) a frame for supporting said process means; and (iii) a cartridge electrode integrally molded by injecting an electroconductive resin into said frame, wherein said cartridge electrode comprises: a first contact portion, exposed toward an outside of said frame, contacted to a main assembly contact provided in the apparatus main assembly when said cartridge is mounted in the apparatus main assembly;a second contact portion provided for being electrically connected to said process means; anda gate portion at which the resin is injected when said cartridge electrode is molded into said frame, wherein the electroconductive resin injected at said gate portion is branched to mold said first contact portion and said second contact portion so that an electroconductive path for electrically connecting the main assembly contact and said process means is formed.
地址 Tokyo JP