Structure for microelectronic packaging with bond elements to encapsulation surface

摘要

A structure may include bond elements having bases joined to conductive elements at a first portion of a first surface and end surfaces remote from the substrate. A dielectric encapsulation element may overlie and extend from the first portion and fill spaces between the bond elements to separate the bond elements from one another. The encapsulation element has a third surface facing away from the first surface. Unencapsulated portions of the bond elements are defined by at least portions of the end surfaces uncovered by the encapsulation element at the third surface. The encapsulation element at least partially defines a second portion of the first surface that is other than the first portion and has an area sized to accommodate an entire area of a microelectronic element. Some conductive elements are at the second portion and configured for connection with such microelectronic element.

主权项

1. A structure comprising:
a substrate having first and second oppositely facing surfaces and a plurality of electrically conductive elements at the first surface; bond elements having bases joined to respective ones of the conductive elements at a first portion of the first surface and end surfaces remote from the substrate and the bases, each of the bond elements extending from the base to the end surface thereof; a dielectric encapsulation element overlying and extending from the first portion of the first surface of the substrate and filling spaces between the bond elements such that the bond elements are separated from one another by the encapsulation element, the encapsulation element having a third surface facing away from the first surface of the substrate and having an edge surface extending from the third surface towards the first surface, wherein unencapsulated portions of the bond elements are defined by at least portions of the end surfaces of the bond elements that are uncovered by the encapsulation element at the third surface; wherein the encapsulation element at least partially defines a second portion of the first surface, the second portion being other than the first portion of the first surface and having an area sized to accommodate an entire area of a microelectronic element, and at least some of the conductive elements at the first surface are at the second portion and configured for connection with the microelectronic element; and solder at least one of the base or the end surface of at least one of the bond elements, wherein the solder extends from the end surface of the at least one bond element through a portion of the encapsulation element towards the third surface.