Method and apparatus for monitoring semiconductor fabrication

摘要

A semiconductor chip for process monitoring of semiconductor fabrication, has a plurality of arrays with a plurality of diodes, each diode being formed in the chip, each diode being associated with a stack with at least one horizontal interconnect, the stack and the diode connected in series to form a diode stack combination, wherein the horizontal interconnect has a salicided polysilicon interconnect comprising complementary doped polysilicon sections to form a reverse biased diode.

主权项

1. A semiconductor chip for process monitoring of semiconductor fabrication, comprising:
a plurality of arrays further comprising:
a plurality of diodes, each said diode being formed in the chip, each said diode being associated with a stack comprising at least one horizontal interconnect, said stack and said diode connected in series to form a diode stack combination, wherein the horizontal interconnect comprises a salicided polysilicon interconnect comprising complementary doped polysilicon sections to form a reverse biased diode.