| 摘要 |
The crystallographically textured metal substrate (1) useful in a device of a photovoltaic cell and module, comprises a connecting surface (2) and a surface (3) intended to receive a thin layer deposit, where the substrate is constituted of an iron-nickel alloy having a face-centered cubic crystalline system and cubic crystallographic texture [100] [001]. The surface receiving the thin layer deposit comprises grains (4) having a majority of crystallographic planes [100] parallel to the surface, and has a roughness (R a) of less than 50 nm. The crystallographically textured metal substrate (1) useful in a device of a photovoltaic cell and module, comprises a connecting surface (2) and a surface (3) intended to receive a thin layer deposit, where the substrate is constituted of an iron-nickel alloy having a face-centered cubic crystalline system and cubic crystallographic texture [100][001]. The surface receiving the thin layer deposit comprises grains (4) having a majority of crystallographic planes [100]parallel to the surface, and has a roughness (R a) of less than 50 nm. The iron-nickel alloy comprises a composition comprising nickel (>= 30 wt.%), copper (= 15 wt.%), chromium (= 15 wt.%), cobalt (= 12 wt.%), manganese (= 5 wt.%), sulfur (less than 0.0007 wt.%), phosphorous (less than 0.003 wt.%), boron (less than 0.0005 wt.%), lead (less than 0.0001 wt.%), 1 wt.% of deoxidizing elements of silicon, magnesium, aluminum and calcium, and impurities. The percentage of nickel, chromium, copper, cobalt and manganese are such that the alloy satisfies a condition, 34%= (Ni+Cr+Cu/2+Co/2+Mn)= 54%. The alloy has an average dilatation coefficient of 10 -> 6>K -> 1>to 10x 10 -> 6>K -> 1>at 20-100[deg] C. The substrate has a thickness of 0.1 mm. The grains on the surface are etched in the form of a pyramid having planes [111] and steps (12) according to the planes to form a blazed network. Independent claims are included for: (1) a crystallographically textured device; (2) a photovoltaic module; and (3) a process for the deposition of a thin silicon layer on the crystallographically textured substrate. |
