ELECTRICAL SYSTEM AND CORE MODULE THEREOF

摘要

Disclosed is a core module comprising: a package substrate having multiple pads; a first component which is connected to the pads of the package substrate corresponding to the first component through multiple first joint parts; a second component which is connected to the pads of the package substrate corresponding to the first component through multiple second joint parts; and a third component which is connected to the pads of the package substrate corresponding to the third component through multiple third joint parts. The first component is located on the second component on the lower package substrate. The first, second, and third components are electrically connected through the package substrate and are molded through a main molding material.