METHOD OF MANUFACUTRUING SEMICONDUCTOR DEVICE STRUCTURE

摘要

The present disclosure relates to a method for manufacturing a semiconductor device structure which includes the steps of: fixing the position of an electrode of a semiconductor device to face a plate as a step of fixing a semiconductor device on a plate; covering the semiconductor device with an encapsulant; and attaching a rigid plate to the encapsulant on a side which is opposite to an electrode exposure side from the encapsulant.