| 摘要 |
The present invention relates to a semiconductor package including a solder ball. More particularly, the present invention relates to a semiconductor package including a solder ball to effectively manage heat generated by a chip. A semiconductor package including a solder ball to effectively manage heat generated by a chip according to an embodiment of the present invention includes a chip mounted on the upper part of a substrate; and a solder ball formed on the lower part of the substrate. According to an embodiment of the present invention, the solder ball includes a solder alloy layer; a shell surrounded by the solder alloy; and a phase change material located in the shell. According to an embodiment of the present invention, the shell is a plastic shell or a metal shell. |
