WIRE-CUTTING APPARATUS FOR SEPARATING THE BONDED MEMBERS

摘要

The present invention relates to a wire-cutting apparatus, and more specifically, to a wire-cutting apparatus to separate a structure where at least two members are bonded by an adhesive, comprising: a base plate in which the structure is fixed; a wire passing through one member and the other member of the structure therebetween; a pair of wire transportation means reciprocating sliding the wire along the longitudinal direction of the base plate and equipped by facing each other around the base plate, wherein the wire is wound on the wire transportation means; and a wire heating means connected to each wire transportation means, and heating the wire that the adhesive can be melted by the wire when the wire passes through one member and the other member therebetween.