发明名称 MANUFACTURING METHOD AND APPARATUS FOR MULTY LAYER FLEXIBLE PRINTED CIRCUIT BOARD BY SCREEN PRINTING
摘要 <p>The present invention relates to a manufacturing method for multi-layer flexible printed circuit board using screen printing of which the overlapped degree of precision of an electric circuit printed on each layer while allowing the distortion of flexible printed circuit board generated during printing the electric circuit multi-layer on the flexible printed circuit board and a device thereof. The manufacturing method for multi-layer flexible printed circuit board using screen printing comprises the following steps: (S1) printing Nth electric circuit on a flexible printed circuit board via Nth screen mask and drying the same; (S2) measuring the length of X and Y axis direction of Nth electric circuit in which printing is completed on the flexible printed circuit board; (S3) manufacturing N+1th screen mask having an electric circuit magnified in an X and Y axis direction than the Nth electric circuit; (S4) forcefully increasing the flexible printed circuit board in which Nth electric circuit is printed to X and Y axis direction as much as the deviation between the length of electric circuit of N+1th screen mask and the length of Nth electric circuit; and (S5) printing the N+1th electric circuit on the forcefully increased flexible printed circuit board via N+1th screen mask.</p>
申请公布号 KR20140127015(A) 申请公布日期 2014.11.03
申请号 KR20130045478 申请日期 2013.04.24
申请人 IES CO., LTD. 发明人 OH, JUNG WHO
分类号 H05K3/12;H05K3/46 主分类号 H05K3/12
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