| 摘要 |
<p>The present invention relates to a method of manufacturing a package board. A core and a copper foil are sequentially stacked symmetrically on upper and lower surfaces of a release film, a copper foil pad and a circuit are formed by selectively etching the copper foil and transferring a predetermined circuit pattern to the copper foil, and an insulation layer or a solder mask are stacked on the copper foil. Subsequently, as one surface of the copper foil pad is exposed by selectively etching and removing the insulation layer or the solder mask according to the predetermined circuit pattern, an opening which is to be connected to a chip terminal is formed. As the release film is peeled off, two upper and lower structures are separated. Then, an opposite surface of the copper foil pad is exposed by selectively etching and removing a core surface of the separated structure with a laser drill to manufacture an opening for forming a solder ball. As a result, the copper foil in the first layer can be connected to the chip terminal and the solder ball on opposite upper and lower sides.</p> |
