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发明名称
整合式高速测试模组
摘要
一种整合式高速测试模组,以一电路基板接收测试机台所提供之第一测试讯号;以及,以一高速基板沿电路基板之上表面由外至内延伸布设,并穿设该电路基板后沿电路基板之下表面朝该电路基板之延伸,如此,本发明之整合式高速测试模组能够同时将不同频段的测试讯号传输至积体电路晶圆之待测晶粒,以进行电性测试。
申请公布号
TW201441639
申请公布日期
2014.11.01
申请号
TW103124758
申请日期
2012.02.02
申请人
旺矽科技股份有限公司
发明人
张嘉泰;顾伟正;谢昭平;王淳吉;郑雅允
分类号
G01R31/28(2006.01);G01R1/073(2006.01)
主分类号
G01R31/28(2006.01)
代理机构
代理人
<name>刘绪伦</name>
主权项
地址
新竹县竹北市中和街155号
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