| 摘要 |
<p>The purpose of the present invention is to provide a film forming method capable of forming a thick film having the uniform film thickness of 50μm or greater on a large substrate having the diameter of 300 mm or greater by spin coating, even when no expensive additive is added to a film forming composition and to provide a substrate with the film formed by the film forming method. The film forming composition containing a solvent and a resin having a vapor pressure and velocity in a predetermined range is coated to the film thickness of 50μm or greater on the large substrate having a diameter of 300 mm or greater by spin coating.</p> |
