| 摘要 |
<p>Disclosed are a sputtering apparatus comprising: a substrate mounting part and multiple targets prepared to oppose each other inside a reaction chamber; multiple backing plates where multiple targets are respectively fixed to one side; multiple guide means respectively prepared between a gap between multiple backing plates; a ground shield whose at least a part is prepared between multiple targets, and prepared at a distance away from the backing plate; and a fixing part protruding in at least one area of the guide means, and inserted into a combining groove of the ground shield.</p> |
