发明名称 METHOD AND APPARATUS FOR MACHINING CIRCULAR SUBSTRATE
摘要 <p>A FIRST MODE OF THE PRESENT INVENTION RELATES TO A CIRCULAR SUBSTRATE MACHINING METHOD COMPRISING A PROCESS OF, AFTER PICKING UP AND HOLDING A CIRCULAR SUBSTRATE (1) FOR A PRESCRIBED PERIOD OF TIME, GIVING TRIMMING TO AT LEAST AN OUTER EDGE OF THE CIRCULAR SUBSTRATE. A SECOND MODE OF THE PRESENT INVENTION RELATES TO A CIRCULAR SUBSTRATE MACHINING APPARATUS COMPRISING A PICKUP MEANS (3) OF HOLDING THE CIRCULAR SUBSTRATE (1) AND A TRIMMING MEANS (4) INCLUDING A TRIMMING GUIDE (40) WITH WHICH AT LEAST THE OUTER EDGE OF THE CIRCULAR SUBSTRATE HELD BY THE PICKUP MEANS IS ALLOWED TO MAKE ROLLING CONTACT. WITH THE ABOVE CONFIGURATION, THE PRESENT INVENTION IS APPLICABLE TO ELIMINATE ANY POSSIBILITY THAT BURR SCRAPS ETC. FALLING OFF FROM THE SUBSTRATE AFFECT PRODUCTS IN PROCESSES LATER THAN STAMPING.</p>
申请公布号 MY152631(A) 申请公布日期 2014.10.31
申请号 MY2006PI03296 申请日期 2006.07.11
申请人 THE FURUKAWA ELECTRIC CO., LTD 发明人 HIDEKI TAKAHASHI;TAKASHI MORI;YASUYUKI OZEKI
分类号 B24B9/00 主分类号 B24B9/00
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