发明名称 ANTENNA FOR CHIP-TO-CHIP WIRELESS POWER TRANSFER
摘要 The present invention relates to an antenna for chip-to-chip wireless power transfer in a three-dimensional wireless chip package. The three-dimensional wireless chip package comprises; a first chip which transfers alternating power through a transmission antenna; and a plurality of second chips which are stacked on the upper side or lower side of the first chip in order and receive the alternating power from the first chip through each of receiving antennas. Each of the receiving antennas is formed on the second chips individually and is separated and formed on the position which does not overlap in upper and lower directions at the upper or lower side of the transmission antenna. By using the antenna for the chip-to-chip wireless power transfer, chip-to-chip wireless power transfer efficiency is improved by forming the antenna formed on a chip which receives wireless power on the position in which the antennas do not overlap in upper and lower directions. Also, an imbalance problem of receiving power by a chip-to-chip distance is solved by varying the size of the antenna on a receiving chip in response to the distance from the antenna on a transmission chip additionally.
申请公布号 KR101456795(B1) 申请公布日期 2014.10.31
申请号 KR20130101079 申请日期 2013.08.26
申请人 SOONGSIL UNIVERSITY RESEARCH CONSORTIUM TECHNO-PARK 发明人 LEE, CHANG HYUN;PARK, CHANG KUN
分类号 H01Q1/24;H02J17/00 主分类号 H01Q1/24
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