| 摘要 |
<p>The present invention relates to a semiconductor package and a method for manufacturing the same. More particularly, the present invention relates to a semiconductor package to improve line degree of freedom, and a method for manufacturing the same. A semiconductor package to improve line degree of freedom according to one embodiment of the present invention includes a package substrate including a substrate connection terminal; a semiconductor chip which is arranged on the package substrate and includes a chip connection terminal; a transparent substrate on the semiconductor chip; a mold layer which covers a side of the transparent substrate, the chip connection terminal, and the substrate connection terminal; and a first line which touches at least one of the substrate terminal and the chip connection terminal and includes a first line which is separated from the transparent substrate.</p> |
