发明名称 SUBSTRATE PLATING DEVICE
摘要 The present invention relates to a plating apparatus having a vibration transferring function. More specifically, the plating apparatus includes a plating vessel filled with a plating liquid, a saddle bar installed above the plating vessel having a clamp fixate a substrate, and a vibration motor installed on the saddle bar. A buoyancy applying device is further installed in the plating vessel to press a lower portion of the substrate provided in the plating vessel towards the saddle bar. The buoyancy applying device includes a guide frame having guide grooves provided on the inner lateral sides of the plating vessel while facing each other provided on an upper portion thereof with a stopper, and a buoyancy bar coupled to the guide frame having a top surface fitted between the guide grooves provided therein with a mounting groove. The buoyancy applying device and the striking device are additionally installed in the plating vessel to support the lower portion of the substrate and transfer vibration such that a plating layer can uniformly be formed on the substrate, and plating efficiency can be improved.
申请公布号 KR101457060(B1) 申请公布日期 2014.10.31
申请号 KR20140052357 申请日期 2014.04.30
申请人 NEOPMC CO., LTD.;BAE, MIN SU 发明人 BAE, MIN SU
分类号 C25D17/00;C25D17/02;C25D17/06 主分类号 C25D17/00
代理机构 代理人
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