发明名称 SOLDER ALLOY
摘要 <p>To provide Sn-Zn series solder alloy that can decrease the amount of occurred dross, suppress discoloration of the fusion solder alloy and re-oxidation, and suppress the erosion phenomenon of Al and Ni even when the fusion solder alloy exposes the air. In order to suppress diffusion of Al and/or Ni to the solder alloy by forming an oxide film on a surface of the solder bath prior to Zn, a solder alloy has an alloy composition containing Zn of 3 through 25 mass %, Ti of 0.002 through 0.25 mass %, Al of 0.002 through 0.25 mass % and balance of Sn.</p>
申请公布号 KR20140126780(A) 申请公布日期 2014.10.31
申请号 KR20147028962 申请日期 2013.04.17
申请人 SENJU METAL INDUSTRY CO., LTD. 发明人 NOMURA HIKARU;YOSHIKAWA SHUNSAKU
分类号 B23K35/26;C22C13/00 主分类号 B23K35/26
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