发明名称 Polishing system
摘要 <p>The present invention provides a polishing system comprising a spray nozzle including a polishing slurry supply pipe in the form of a pipe where polishing slurry flows inside, and an MR fluid supply pipe in the form of a pipe having the polishing slurry supply pipe inside, and where an MR fluid flows in the outer circumferential surface of the polishing slurry supply pipe; a polishing slurry supply part for supplying polishing slurry to the polishing slurry supply pipe; an MR fluid supply pipe for supplying polishing slurry to the MR fluid supply pipe; an electromagnet module located on the outer circumferential surface of the spray nozzle to supply a magnetic field to the MR fluid; and a support part arranged at a distance away from one side of the spray nozzle to support a polished material. According to the present invention, the polishing system is capable of spraying an MR fluid with an abrasive through a nozzle, so the sprayed fluid maintains a concentration due to the applied magnetic field, and uniform polishing spots can be generated. Therefore, super-precise polishing is possible.</p>
申请公布号 KR101456775(B1) 申请公布日期 2014.10.31
申请号 KR20130016238 申请日期 2013.02.15
申请人 发明人
分类号 B24C5/02;B24C7/00 主分类号 B24C5/02
代理机构 代理人
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