| 发明名称 |
INTEGRATED CIRCUIT PACKAGE HAVING A SPLIT LEAD FRAME AND A MAGNET |
| 摘要 |
A magnetic field sensor includes a lead frame having a plurality of leads, at least two of which have a connection portion and a die attach portion. A semiconductor die is attached to the die attach portion of the at least two leads and a separately formed ferromagnetic element, such as a magnet, is disposed adjacent to the lead frame. |
| 申请公布号 |
US2014320124(A1) |
申请公布日期 |
2014.10.30 |
| 申请号 |
US201313871131 |
申请日期 |
2013.04.26 |
| 申请人 |
ALLEGRO MICROSYSTEMS, LLC |
发明人 |
David Paul;Vig Ravi;Taylor William P.;Friedrich Andreas P. |
| 分类号 |
G01R33/09 |
主分类号 |
G01R33/09 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A magnetic field sensor comprising:
a lead frame having a first surface, a second opposing surface, and comprising a plurality of leads, wherein at least two of the plurality of leads have a connection portion and a die attach portion; a semiconductor die supporting a magnetic field sensing element and attached to the die attach portion of the at least two leads adjacent to the first surface of the lead frame; and a separately formed ferromagnetic element disposed adjacent to the lead frame. |
| 地址 |
Worcester MA US |
