PHOTOCURABLE ADHESIVE FILM FOR ORGANIC ELECTRONIC DEVICE SEAL, ORGANIC ELECTRONIC DEVICE, AND METHOD FOR SEALING SAME

摘要

Provided are a photocurable pressure-sensitive adhesive composition including an acrylic polymer, an epoxy resin, and a cationic photopolymerization initiator, an organic electronic device having an encapsulant including a photocured product of the composition using a curable pressure-sensitive adhesive film which is a film-state product including the composition, and a method for manufacturing an organic electronic device using the curable pressure-sensitive adhesive film. Particularly, due to the method including laminating a photocurable pressure-sensitive adhesive film including a curable pressure-sensitive adhesive layer including an acrylic polymer, an epoxy resin, and a cationic photopolymerization initiator to an top substrate, and radiating light to an entire surface of the curable pressure-sensitive adhesive layer to perform photocuring, and laminating the photocured curable pressure-sensitive adhesive layer to a bottom substrate on which an organic light emitting element is formed to cover an entire surface of the organic light emitting element, mechanical strength and a simple process caused by photocuring to the organic light emitting element without direct light irradiation may be achieved, and a lifespan of the element may be increased.

主权项

1. An organic electronic device, comprising:
a substrate on which an organic light emitting element is formed; and a curable pressure-sensitive adhesive film encapsulating an entire surface of the organic light emitting element on the substrate, wherein the curable pressure-sensitive adhesive film is a semi-solid at room temperature and comprises a curable pressure-sensitive adhesive layer comprising a photocured-product of a photocurable pressure-sensitive adhesive composition comprising an acrylic polymer, an epoxy resin, and a cationic photopolymerization initiator, and the curable pressure-sensitive adhesive layer has a viscosity before light irradiation of 105 to 107 Pa·s and a viscosity after light irradiation of 106 to 108 Pa·s.