发明名称 |
SEMICONDUCTOR WAFER POLISHING LIQUID COMPOSITION |
摘要 |
There is provided a polishing liquid composition that can effectively reduce LPDs having a size of 50 nm or less on a wafer surface in polishing of semiconductor wafers. A semiconductor wafer polishing liquid composition including: water; silica particles; an alkaline compound; a water-soluble polymer compound; and polyethylene glycol, wherein the semiconductor wafer polishing liquid composition satisfies conditions (a) to (c): (a) a shape factor SF1 of the silica particles is 1.00 to 1.20, (b) a mean primary particle diameter of the silica particles that is obtained by a nitrogen adsorption method is 5 nm to 100 nm, and a coefficient of particle diameter variation CV value obtained from image analysis of the transmission electron microscope image is in a range of 0% to 15%, and (c) the polyethylene glycol has a number average molecular weight of 200 to 15,000. |
申请公布号 |
US2014319411(A1) |
申请公布日期 |
2014.10.30 |
申请号 |
US201114357673 |
申请日期 |
2011.11.16 |
申请人 |
Sakaida Hiroaki;Araki Fumiaki;Kashima Yoshiyuki |
发明人 |
Sakaida Hiroaki;Araki Fumiaki;Kashima Yoshiyuki |
分类号 |
C09G1/02 |
主分类号 |
C09G1/02 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor wafer polishing liquid composition comprising:
water; silica particles; an alkaline compound; a water-soluble polymer compound; and polyethylene glycol, wherein the semiconductor wafer polishing liquid composition satisfies conditions (a) to (c): (a) a shape factor SF1 of the silica particles as represented by Expression (1) below is 1.00 to 1.20,
SF1=(DL2×π/4)/S (1) (where DL is the maximum length (nm) of a silica particle obtained from a transmission electron microscope image, and S is a projected area (nm2) of a silica particle), (b) a mean primary particle diameter of the silica particles that is obtained by a nitrogen adsorption method is 5 nm to 100 nm, and a coefficient of particle diameter variation CV value obtained from image analysis of the transmission electron microscope image is in a range of 0% to 15%, and (c) the polyethylene glycol has a number average molecular weight of 200 to 15,000. |
地址 |
Sodegaura-shi JP |